Engineering The Physical Core of Intelligent Products

Delivering robust hardware platforms – from schematic to system-level validation – optimized for embedded, edge, and industrial applications

Why MosChip for Hardware & System Engineering

Proven Engineering Across Board Design, Validation, and Integration

Over 100+ boards designed and deployed for embedded, industrial, and IoT systems

End-to-end capabilities from schematic to bring-up and validation

High-speed interfaces (DDR, PCIe, USB, Ethernet, MIPI) and power-aware designs

Compliance-aware engineering: signal integrity, thermal, EMI/EMC, pre-cert

Strong collaboration with SoC vendors and firmware teams

What We Deliver?

High-speed, multi-layer PCB design (HDI, flex-rigid, BGA) optimized for cost, manufacturability, and volume production

Rugged, thermally-optimized, miniaturized enclosures (HE30/31, single-piece heatsinks)

Post-silicon bring-up, hardware validation, characterization (PVT, thermal, electrical), pre-certification testing

Obsolescence handling, cost-optimized redesigns, platform modernization

SI/PI, TDR, thermal & EMC simulation

Key Technologies

Expertise in Core Technologies for Intelligent, Connected Systems Development

Compute & Processing

ARM SoCs and microcontrollers

RISC-V based platforms

FPGAs and RFSoCs (Xilinx, Intel, Lattice)

Interfaces & Connectivity

DDR2, DDR3, DDR4, DDR5, LPDDR

PCIe Gen2/Gen3/Gen4/Gen5

MIPI CSI/DSI

USB 2.0, USB 3.0

HDMI, SATA, SERDES

BLE, CAN, RS232, RS485, Ethernet

Design & Simulation Tools

PCB Design: Altium Designer, OrCAD, Cadence, KiCad

Mechanical Design: SolidWorks, Creo, Fusion 360

SI/PI & Compliance: Ansys SI/PI, Cadence Sigrity, HyperLynx, TDR tools

Design Considerations

SI/PI analysis and power-aware design

Thermal and mechanical integration

EMI/EMC pre-certification practices

Products Enabled

Featured Case Study

Software Support for USB Device IP

The client is US based leading semiconductor company having expertise in high-performance and adaptive computing products spanning CPUs…
FAQs
What types of boards has MosChip designed and deployed?

We’ve delivered over 100 production-grade boards across industrial gateways, edge AI modules, smart meters, automotive loggers, and medical diagnostic devices – supporting both high-speed digital and mixed-signal requirements.

Can you support compliance and pre-certification needs (EMI/EMC, thermal, etc.)?

Yes. Our team integrates EMI/EMC design best practices, performs thermal profiling, and supports pre-certification testing aligned with global regulatory standards.

What toolchains do you use for hardware design and simulation?

We use industry-standard tools including Altium, Cadence, OrCAD, SolidWorks, Ansys SI/PI, Sigrity, HyperLynx, and TDR tools – and can adapt to customer-preferred flows.

Do you support ruggedized or miniaturized form factor designs?

Yes. We’ve engineered thermal and mechanically optimized enclosures for industrial, medical, and automotive use-cases, including compact, passively cooled, and high-IP-rated designs.

Do you provide post-silicon validation support?

Absolutely. We support bring-up, signal integrity and functional validation, characterization across voltage and temperature (PVT), and support board-level debug, diagnostics, and hardware-assisted firmware validation.

Looking to accelerate your connected product development with experienced hardware teams?

Engineering The Physical Core of Intelligent Products

Delivering robust hardware platforms – from schematic to system-level validation – optimized for embedded, edge, and industrial applications

Why MosChip for Hardware & System Engineering

Proven Engineering Across Board Design, Validation, and Integration

Over 100+ boards designed and deployed for embedded, industrial, and IoT systems

End-to-end capabilities from schematic to bring-up and validation

High-speed interfaces (DDR, PCIe, USB, Ethernet, MIPI) and power-aware designs

Compliance-aware engineering: signal integrity, thermal, EMI/EMC, pre-cert

Strong collaboration with SoC vendors and firmware teams

High-speed, multi-layer PCB design (HDI, flex-rigid, BGA) optimized for cost, manufacturability, and volume production

Rugged, thermally-optimized, miniaturized enclosures (HE30/31, single-piece heatsinks)

Post-silicon bring-up, hardware validation, characterization (PVT, thermal, electrical), pre-certification testing

Obsolescence handling, cost-optimized redesigns, platform modernization

SI/PI, TDR, thermal & EMC simulation

What We Deliver?

Key Technologies

Expertise in Core Technologies for Intelligent, Connected Systems Development

Compute & Processing

ARM SoCs and microcontrollers

RISC-V based platforms

FPGAs and RFSoCs (Xilinx, Intel, Lattice)

Interfaces & Connectivity

DDR2, DDR3, DDR4, DDR5, LPDDR

PCIe Gen2/Gen3/Gen4/Gen5

MIPI CSI/DSI

USB 2.0, USB 3.0

HDMI, SATA, SERDES

BLE, CAN, RS232, RS485, Ethernet

Design & Simulation Tools

PCB Design: Altium Designer, OrCAD, Cadence, KiCad

Mechanical Design: SolidWorks, Creo, Fusion 360

SI/PI & Compliance: Ansys SI/PI, Cadence Sigrity, HyperLynx, TDR tools

Design Considerations

SI/PI analysis and power-aware design

Thermal and mechanical integration

EMI/EMC pre-certification practices

Products Enabled

Featured Case Study

Software Support for USB Device IP

The client is US based leading semiconductor company having expertise in high-performance and adaptive computing products spanning CPUs…
FAQs
What types of boards has MosChip designed and deployed?

We’ve delivered over 100 production-grade boards across industrial gateways, edge AI modules, smart meters, automotive loggers, and medical diagnostic devices – supporting both high-speed digital and mixed-signal requirements.

Can you support compliance and pre-certification needs (EMI/EMC, thermal, etc.)?

Yes. Our team integrates EMI/EMC design best practices, performs thermal profiling, and supports pre-certification testing aligned with global regulatory standards.

What toolchains do you use for hardware design and simulation?

We use industry-standard tools including Altium, Cadence, OrCAD, SolidWorks, Ansys SI/PI, Sigrity, HyperLynx, and TDR tools – and can adapt to customer-preferred flows.

Do you support ruggedized or miniaturized form factor designs?

Yes. We’ve engineered thermal and mechanically optimized enclosures for industrial, medical, and automotive use-cases, including compact, passively cooled, and high-IP-rated designs.

Do you provide post-silicon validation support?

Absolutely. We support bring-up, signal integrity and functional validation, characterization across voltage and temperature (PVT), and support board-level debug, diagnostics, and hardware-assisted firmware validation.

Looking to accelerate your connected product development with experienced hardware teams?