Full-Cycle Turnkey ASIC Development
From RTL to Volume Production - an integrated engagement model
Why MosChip for Turnkey ASIC?
A Trusted Engineering Partner for Full-Cycle ASIC Execution
Publicly listed with 25+ years of silicon leadership
Engineering Services DNA with a Product Mindset
900+ engineers across design, verification, layout, physical and testing teams
Delivered ASICs across automotive, consumer, HPC, Telecommunication, and industrial segments
Transparent execution with risk-managed delivery models
Multi-node (180nm to 2 nm) expertise with successful tape-outs
How Our Turnkey Model Delivers Differentiated Value
Designed for Predictability, Built for Performance
End-to-end ownership with single-point accountability
Proven IP integration, reuse, and porting expertise
Digital IPs: USB3.0 Device/Host/Retimer, USB2.0 Host/Device Controller, Ethernet 10/100 MAC, I2C Master/Slave, SPI Master/Slave, UART/Serial Port, IrDA, IEEE1284 Parallel Port Controller, Generic GPIO Controller
Analog IPs: Power management, Clock management, LCD panel controller, Temperature sensor, 12-bit SAR ADC and 24-bit Sigma Delta ADC
Design Center Alliance Partner for TSMC. Deep engagement with other foundries like UMC, GlobalFoundries, Samsung, Intel and OSAT partners
Mature sign-off checklists, toolchain proficiency
Early test planning + packaging + yield optimization
Fixed-scope, milestone-based, or hybrid delivery
Featured Case Study
Wireless Sensor Network
Yes. We have tape-out experience at major nodes including 7nm, 5nm, and 3nm.
Yes, we support both.
We manage direct foundry engagement (including documentation, sign-off, and logistics) as part of the turnkey model.
Engage with us
Full-Cycle Turnkey ASIC Development
From RTL to Volume Production - an integrated engagement model
Why MosChip for Turnkey ASIC?
A Trusted Engineering Partner for Full-Cycle ASIC Execution
Publicly listed with 25+ years of silicon leadership
Engineering Services DNA with a Product Mindset
900+ engineers across design, verification, layout, physical and testing teams
Delivered ASICs across automotive, consumer, HPC, Telecommunication, and industrial segments
Transparent execution with risk-managed delivery models
Multi-node (180nm to 2 nm) expertise with successful tape-outs
How Our Turnkey Model Delivers Differentiated Value
Designed for Predictability, Built for Performance
End-to-end ownership with single-point accountability
Proven IP integration, reuse, and porting expertise
Digital IPs: USB3.0 Device/Host/Retimer, USB2.0 Host/Device Controller, Ethernet 10/100 MAC, I2C Master/Slave, SPI Master/Slave, UART/Serial Port, IrDA, IEEE1284 Parallel Port Controller, Generic GPIO Controller
Analog IPs: Power management, Clock management, LCD panel controller, Temperature sensor, 12-bit SAR ADC and 24-bit Sigma Delta ADC
Design Center Alliance Partner for TSMC. Deep engagement with other foundries like UMC, GlobalFoundries, Samsung, Intel and OSAT partners
Mature sign-off checklists, toolchain proficiency
Early test planning + packaging + yield optimization
Fixed-scope, milestone-based, or hybrid delivery
Featured Case Study
Wireless Sensor Network
Yes. We have tape-out experience at major nodes including 7nm, 5nm, and 3nm.
Yes, we support both.
We manage direct foundry engagement (including documentation, sign-off, and logistics) as part of the turnkey model.
